1. Check if there are any polished marks on the surface of the chip. The surface of polished chips may have fine lines or even micro marks of previous printing, and some even have a thin layer of paint applied to cover it up, which looks a bit shiny and lacks the texture of plastic.
2. Look at the printing. The vast majority of chips nowadays use laser marking or specialized chip printing machines to print, with clear handwriting that is neither prominent nor blurry, and difficult to erase. The refurbished chip either has a "jagged" feeling due to the corrosion of the cleaning agent on the edges of the handwriting, or the printing is blurry, uneven in depth, misaligned in position, easy to erase, or overly prominent. In addition, the screen printing process has long been phased out by large IC manufacturers, but many chip refurbishments still use the screen printing process due to cost reasons. This is also one of the criteria for judgment. The characters printed on the screen will be slightly higher than the surface of the chip, and slight unevenness or astringency can be felt by hand. However, it should be noted that due to the significant decrease in the price of small laser marking machines recently, more and more refurbished ICs are using laser marking. Some new chips may also use this method to change the font mark or simply re print to "improve" the grade of the chip. This requires special attention and differentiation methods are more difficult, requiring the practice of "eye catching and eye catching". The main method is to look at the overall coordination. If the handwriting does not match the background and the degree of novelty of the pins, there is a high possibility of problems such as over new or over clear character labels. However, many small factories, especially some small IC companies in China, are born with this, which adds a lot of trouble to the identification. However, this method is still meaningful for the judgment of mainstream large factory chips. In addition, there has been an increasing phenomenon of using laser marking machines to modify chip markings recently, especially in memory and some high-end chips. Once it is found that there are individual letters and uneven stroke thickness in the position of laser printing, it can be considered as Remark.
3. Look at the pins. All tinned pins that are as bright as' new 'must be refurbished. Most of the pins of the original IC should be so-called' silver powder pins', which are dark in color but uniform in quality. There should be no oxidation marks or 'flux' on the surface. In addition, the pins of DIP and other plug-ins should have no scratches. Even if there are scratches (only after packaging again), they should be neat and in the same direction, and the metal exposure should be smooth and free of oxidation.
4. Check the device production date and packaging factory label. The label of the original product, including the label on the bottom of the chip, should be consistent and the production time should match the device product, while the label of the refurbished chip that has not been remarked is chaotic and the production time is inconsistent. Although the labels on the front of Remark's chips are consistent, sometimes the numerical values do not conform to common sense (such as what 'lucky number' is marked) or the production date does not match the device product. If the labels on the bottom of the device are very chaotic, it also indicates that the device is Remark's.
5. Measure the thickness of the device and observe the edge of the device. Many original laser printed polishing and refurbishing sheets (mostly power devices) need to be polished deeper to remove the original mark, so that the overall thickness of the device will be significantly smaller than the normal size. However, without comparison or measuring with a caliper, it is generally difficult for inexperienced people to distinguish. However, there is an alternative method of identification, which is to look at the front edge of the device. Due to the need for 'demolding' of plastic encapsulated components after injection molding, the edges and corners of the components are circular (R angle), but the size is not large, making it easy to grind this rounded corner straight during polishing processing